- HOME
- Products
- Basic materials
- Technical conditions
- Technological equipment
- CAD CAM
- The Laser Photoplotter
- CNC drilling and routing
- UV Laser drilling and routing
- Laser Tannlin TX PROi
- Direct plating
- Vyplňování otvorů | Planarizer
- Surface readjustments
- Surface finishes
- Galvanic processes
- Digital Direct Imaging
- The etching
- Solder mask and silkscreen
- Inspections of PCB
- Controlled impedance
- Multilayer lamination
- Contour fabrication
- Analytical Laboratory
- PCB Designs
- PCB assembly
- Terms and Conditions
- Preislist
- Contact
- kariéra
Capability list
| Parameter | Standard production | Possible on Request |
| Products | 1-12L PCB, FPC, FLEX-RIGID, Laser Cutted SMT Stencil | |
| Input Data Formats | Gerber, Excellon, Sieb&Mayer, ODB++ | DXF, HPGL |
| basic material | FR4, Rogers RO4350B, IS400, IS410, P96, Polyimid, AL core | Teflon, IS620....... |
| No. of Conductive Layers Rigid | 1 -12 | 12 and more |
| No. of Conductive Layers FLEX | 3 | 4 and more |
| RIGID FR4 Laminate Thickness in Stock | table of basic material | other thickness on request |
| FLEXIBLE Material Thickness | 25, 50, 75, 100 and 125µm | |
| Cu foil Thickness | 9µm, 18µm, 35µm, 70µm and 105µm | 150µm and 210µm |
| Minimum Production Panel Size | 195x290mm | |
| Maximum PCB Size ( 1S, 2S and ML ) | 400x520mm | 500x600mm |
| Min. PCB Thickness | 2-layer - 0,1mm 4-layer - 0,3mm 6-layer - 0,5mm 8-layer - 0,7mm |
2-layer - 0,07mm |
| Max. PCB Thickness | 3,2mm | 5mm |
| Min. T/G/Annular Ring | 0,12 / 0,12mm | 0,1 / 0,1mm |
| Min. drilled Hole | 0,2mm | 0,1mm |
| Max. drilled Hole | 6,4mm | over 6,4mm routed |
| Blind and Burried Vias | Yes, BLV 1:1, Burried Vias Plugged | |
| Plated Slots | 1,0mm and bigger, Controlled Depth | 0,6 - 1,0mm |
| Smallest Routing Tool | 1,0mm | 0,6 - 1,0mm |
| Routing Tolerance | 0,1mm | 0,1mm |
| V-scoring | material 0,5 - 3,2mm, JUMP V-scoring | |
| V-scoring Positioning Tolerance | +/-0,1mm in relation to drill | |
| Photoimageable Soldermask | green | Blue, Red, Yellow, White, Bring White, Clack, HTg Resistant |
| Soldermask for FPC | Photoimageable Green or Amber, PI foil ( Coverlay ) | Photoimageable Black |
| Peelable Mask | yes, blue | |
| Marking Print | white | Blue, Red, Yellow, Black |
| Min. Marking Print Line Size | 0,12mm | 0,1mm |
| Carbon paste | yes | |
| Surface Protection Procces | H.A.S.L. : 6 - 8µm imersion Au : 4µm Ni / 0,09µm Au imersion Sn : 1 - 1,2µm galvanic Au ( Up to Size 100x300mm ) : 5µm Ni / 1µm Au |
OSP and other |
| Galvanic Au | yes | |
| Laser Cutted SMT Stencil | 80µm - 250µm | other materials |
| Max. Stencil Size | 600x600mm | 600x600mm |
| Production Times | standard : 10 working days expres : 1 - 9 working days |
8 hour |
| Testing | 100% E-test Flying Probe, Optical AOI | |
| Minimal order quantity | from 1pc | |
| Maximal order quantity | on request | |
| shippment | Czech post EMS, UPS, DHL, TNT ..... |


company adress :
place of business :



